? 388 ? micro chip fuse design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. e 1 product code micro chip fuse structure rectangular type product shape 3216 size (3.2 mm 1.6 mm) packaging type code punched carrier taping 4m m pitch, 5,000 pcs. r 2 b 3 r 4 d 5 1 6 7 r 8 0 9 0 10 x v r g 1608 size (1.6 mm 0.8 mm) e rated current (a) 0r25 0r31 0r37 0r50 0r75 1r00 1r25 0.25 a 0.315 a 0.375 a 0.50 a 0.75 a 1.0 a 1.25 a 1r50 2r00 2r50 3r00 4r00 5r00 1.5 a 2.0 a 2.5 a 3.0 a 4.0 a 5.0 a 1005 size (1.0 mm 0.5 mm) d pressed carrier taping 2m m pitch, 10,000 pcs. erbrd erbre erbrg x almina substrate fusing element electrode (outer) protective coating electrode (base) a b t w l micro chip fuse t ype: erbrd erbre erbrg explanation of part numbers fe atures small size fast-acting and withstanding in-rush current characteristics construction dimensions in mm (not to scale) t ype (inch size) dimensions (mm) mass (weight) (g/1000 pcs.) lwa b t erbrd (0402) 1.00 0.10 0.50 +0.10 0.15 0.10 0.25 0.10 0.39 0.10 0.7 erbre (0603) 1.60 0.15 0.80 +0.15 0.24 0.15 0.30 0.15 0.54 0.10 2.2 erbrg (1206) 3.20 0.20 1.60 0.15 0.30 0.20 0.55 0.20 0.65 0.10 10 -0.05 -0.05 approved safety standards ul248-14 : file no.e194052 c-ul c22.2 no.248-14 : file no.e194052 sep. 2010 00
? 389 ? micro chip fuse design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. ratings 1608 (0603 inch) size (type erbre) part no. erbre r v 0r50 0r75 1r00 1r25 1r50 2r00 2r50 3r00 4r00 5r00 rated current (a) 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0 5.0 marking code f g h j k n o p s t internal r (m ) at 25 c max. 330 190 125 94 72 51 40 33 22 19 fusing current/fusing time (at 25 c) rated current 100 %/4 hours min. rated current 200 %/5 seconds max. rated current 300 %/0.2 seconds max. rated voltage (open circuit voltage) 32 vdc interrupting rating (at rated voltage) 50 a category temp. range ?40 c to 125 c 1005 (0402 inch) size (type erbrd) part no. erbrd r x 0r25 0r31 0r37 0r50 0r75 1r00 1r25 1r50 2r00 2r50 3r00 rated current (a) 0.25 0.315 0.375 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 marking code v x y f g h j k n o p internal r (m ) at 25 c max. 700 520 440 310 190 125 82 70 53 42 37 fusing current/fusing time (at 25 c) rated current 100 %/4 hours min. rated current 200 %/5 seconds max. rated current 300 %/0.2 seconds max. rated voltage (open circuit voltage) 32 vdc interrupting rating (at rated voltage) 35 a category temp. range ?40 c to 125 c part no. erbrg r v 0r50 0r75 1r00 1r25 1r50 2r00 2r50 3r00 4r00 rated current (a) 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0 marking code f g h j k n o p s internal r (m ) at 25 c max. 560 340 210 175 115 85 65 45 35 fusing current/fusing time (at 25 c) rated current 100 %/4 hours min. rated current 200 %/5 seconds max. rated current 300 %/0.2 seconds max. rated voltage (open circuit voltage) 63 vdc 32 vdc interrupting rating (at rated voltage) 50 a category temp. range ?40 c to 125 c 3216 (1206 inch) size (type erbrg) mass production : april 2011 ? the thin type is available about 1005 (0402 inch) size. please contact us for details. ? please contact us when another rated current is needed. dec. 2010 01
? 390 ? micro chip fuse design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. tt a p 0 p 2 p 1 p 1 d 0 b f w e 2m m pitch
1 s f t t f e $ b s s j f s 1 v o d i f e $ b s s j f s n w 2 w 1 a c 100 fusing time (s) 0.0001 0.001 0.01 0.1 1 10 0.1 1 10 100 fusing time (s) 0.0001 0.001 0.01 0.1 10 1 0.1 1 10 fusing current (a) fusing current (a) 0.5 a 0.75 a 1.0 a 1.25 a 1.5 a 2.0 a 2.5 a 3.0 a 4.0 a 5.0 a 1608 (0603 inch) size (type erbre) 1005 (0402 inch) size (type erbrd) 0.5 a 0.25 a 0.315 a 0.375 a 0.75 a 1.0 a 1.25 a 1.5 a 2.0 a 2.5 a 3.0 a 100 fusing time (s) 0.0001 0.001 0.01 0.1 1 10 0.1 1 10 fusing current (a) 3216 (1206 inch) size (type erbrg) 0.5 a 0.75 a 1.0 a 1.25 a 1.5 a 2.0 a 2.5 a 3.0 a 4.0 a ? reference only ? reference only ? reference only ?0 fusing characteristics (25 c typical) carrier taping ta ping reel pa c kaging methods standard quantity t ype a b w f e erbrd 0.68 0.10 1.20 0.10 8.00 0.20 3.50 0.05 1.75 0.10 erbre 1.05 0.10 1.85 0.10 erbrg 2.00 0.15 3.60 0.20 t ype kind of taping pitch (p 1 ) quantity erbrd pressed carrier taping 2 mm 10000 pcs./ reel erbre punched carrier taping 4 mm 5000 pcs./ reel erbrg (unit : mm) t ype p 1 p 2 p 0 d 0 t erbrd 2.00 0.10 2.00 0.05 4.00 0.10 1.50 +0.10 0.67 0.07 erbre 4.00 0.10 0.78 0.07 erbrg 0.84 0.07 (unit : mm) type a n cw 1 w 2 erbrd erbre erbrg 180.0 ?1.5 60 ?0 13.0 0.2 9.0 ?0 11.4 1.0 +0 +1.0 +1.0 sep. 2010 00
? 391 ? micro chip fuse design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. c a b preheating peak heating temperature time the following are precautions for individual products. please also refer to the common precautions shown on page 4 of this catalog. 1. set the rated current so that the current passing through the micro chip fuses (hereafter called the fuses) under normal conditions is within 70% of the rated current. 2. do not continuously pass a current exceeding the rated current through the fuses. 3. if a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take care not to cause unwanted fusing. calculate the i 2 t value of the pulse and check the tolerance to the number of pulses according to the i 2 t-t characteristic curve before deciding to use the fuses. before checking the tolerance, consult our sales staff in advance. 4. the fuses are designed to be blown out by a current that is double or greater than the rated current. ensure that the abnormal current generated when a circuit abnormality occurs in your product is at least double or greater than the rated current of the fuses. in addition, ensure that the abnormal cur r ent of your product does not exceed the maximum interrupting current of the fuses. 5. the fuses are designed to be used on the secondary side of a power supply. do not use them on the primary side. 6. ensure that the voltage applied to the fuses are within their rated voltage. 7. the fusing characteristics of the fuses are affected by the ambient temperature. before use, mount the fuses on your products and carefully check and evaluate their category temperature range. safety precautions recommended land pattern preheat with a blast of hot air or similar method. use a soldering iron with a tip temperature of 350 c or less. solder each electrode for 3 seconds or less. never touch this product with the tip of a soldering iron. t ype (inch size) dimensions (mm) abc erbrd(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 erbre(0603) 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0 erbrg(1206) 2.0 to 2.4 4.4 to 5.0 1.2 to 1.8 temp erature time preheating 140 c to 160 c 60 s to 120 s main heat ing above 200 c 30 s to 40 s peak 235 5 c max. 10 s temp erature time preheating 150 c to 180 c 60 s to 120 s main heat ing above 230 c 30 s to 40 s peak max. 260 c max. 10 s for soldering for le ad-free so ldering temp erature tim etemperaturetime preheating 140 c to 180 c 60 s to 120 s 150 c to 180 c 60 s to 120 s soldering 245 5 c 20 s to 30 s max. 260 c max. 10 s recommended soldering conditions recommendations and precautions are described below. recommended soldering conditions for re? ow for soldering (example : sn/pb) for lead-free soldering (example : sn/ag/cu) recommended soldering conditions for ? ow re? ow soldering shall be performed a maximum of two times. please contact us for additional information when used in conditions other than those speci? ed. please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. sep. 2010 00
? 4 ? safety precautions (common precautions for fixed resistors, noise suppression device, esd suppressor, fuses, and mr sensors) when using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the speci? cations with us in advance. the design and speci? cations in this catalog are subject to change without prior notice. do not use the products beyond the speci? cations described in this catalog. this catalog explains the quality and performance of the products as individual components. before use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signi? cant dam age, such as damage to vehicles (automobile, train, vessel), traf? c lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ? systems equipped with a protection circuit and a protection device ? systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault (1) precautions for use these products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. av equipment, home electric appliances, of? ce equipment, information and communication e quipment) these products are not intended for use in the following special conditions. before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. electric static discharge (esd) environment (except esd suppressors) these components are sensitive to static electricity and can be damaged under static shock (esd). please take measures to avoid any of these environments. smaller componen ts are more sensitive to esd environment. 5. electromagnetic environment avoid any enviro nment wher e strong electromagnetic waves exist. 6. in an environment where these products cause dew condensation 7. sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials these products generate joule heat when energized. carefully position these products so that their heat will not affect the other components (except thermal cutoffs). carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. do not mount or place heat-generating components or in? ammables, such as vinyl-coated wires, near these products (except thermal cutoffs). note that non-cleaning solder, halogen-based highly active ? ux, or water-soluble ? ux may deteriorate the performance or reliability of the products. carefully select a ? ux cleaning agent for use after soldering. an unsuitable agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. otherwise, the insulation performance may be deteriorated. (2) precautions for storage the performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 c to 35 c and a relative humidity of 45 % to 85 %. the performance of emi filters is guaranteed for 6 months or a year after our delivery, provided that they are stored at a temperature of -5 c to +40 c and a relative humidity of 40 % to 60 %. check the guarantee period in the speci? cations. the performance of thermal cut offs is guaranteed for a year after our delivery, provided that they are stored at a temperature of -10 c to +40 c and a relative humidity of 30 % to 75 %. even within the above guarantee periods, do not store these products in the following conditions. otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package markings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. sep. 2010 00
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